Financial News

 47 results found for Financial News, displaying items 1 - 20

August 2010   [Industry News]
NXP Boosts Portfolio With Jennic Acquisition
NXP SEMICONDUCTORS has acquired Jennic, a developer of lowpower RF solutions. The firm’s solutions target wireless applications in the smartenergy, environment, logistics, and consumer markets. NXP paid approximately $12.2 million to acquire 100 percent ownership of Jennic shares. It will pay up to $7.8 million in additional consideration over the next two years...  — Dawn Hightower

July 2010   [Industry News]
Boeing To Acquire Argon ST
The Boeing Company and Argon have entered into an agreement whereby Boeing will acquire Argon ST in an all-cash tender offer and merger for $34.50 per share, or approximately $775 million, net of cash acquired. This acquisition is expected to advance Boeing’s growth strategy while expanding its capabilities to address the command, control, communications, computers, intelligence, surveillance, and reconnaissance (C4ISR), cyber, and intelligence...  — Dawn Hightower

June 2010   [Industry News]
Comtech Telecommunications Acquires CPI
COMTECH TELECOMMUNICATIONS CORP. and CPI International, Inc. jointly announced the signing of a definitive merger agreement under which Comtech will purchase CPI in a cash and stock transaction with an enterprise value of approximately $472.3 million. Comtech will fund the acquisition by redeploying approximately $372.0 million of its existing cash. It also will issue approximately 4.4 million shares of Comtech common stock. CPI’s sales and earnings...  — Dawn Hightower

May 2010   [Industry News]
Sanswire Receives SkySat UAV Contract
SANSWIRE CORP. has announced that defense-contractor Global Telesat Corp. (GTC) has agreed to purchase a 50-percent interest in one SkySat airship for $250,000. GTC has an option to purchase the remaining 50 percent for an additional $750,000. The agreement states that Sanswire will initially receive $250,000 from GTC in exchange for a 50-percent interest in one SkySat airship. Sanswire will immediately deliver the existing airship to a facility designated by Global...  — Dawn Hightower

April 2010   [Industry News]
LPKF’s Record Earnings Exceed Forecasts
THE LPKF GROUP, which is headquartered in Garbsen, Germany, closed the 2009 financial year with earnings before interest and tax (EBIT) of €7 million (approximately $9,437,396 US dollars) compared to €3.1 million for the previous year. Consolidated sales rose by 12 percent to €50.7 million (approximately $67,409,973) versus €45.4 million for the previous year. Incoming orders at €56 million (approximately $75,499,170) were well up on the previous year’s...  — Dawn Hightower

March 2010   [Industry News]
Companies Pursue Technology Alliance
CASCADE MICROTECH, INC. and sUss Microtec aG have pursued a strategic alliance to address the growing device complexities of emerging semiconductor technologies. the two companies hope to bring innovative approaches to three-dimensional (3d) through-silicon-via (tsV) manufacturing processes. Both firms expect to use their associations with leading research organizations like iMeC as well as industry partnerships to gain insight into this cutting-edge...  — Dawn Hightower

February 2010   [Industry News]
Plessey Semiconductors Is Reborn
PLESSEY SEMICONDUCTORS has been spawned from the acquisition of the share capital of X-FAB UK Ltd. together with existing engineering competence within a design and technology center located in Swindon, UK. The name of the operating business has been subsequently changed to Plessey Semiconductors. The firm is now trading from its semiconductor manufacturing facility in Roborough, Plymouth, UK. That facility currently produces 8-in. wafers for...  — Dawn Hightower

January 2010   [Industry News]
Cree Acquires Daimler AG SiC And Power Patent Portfolio
CREE, INC. has acquired a portfolio of patents and patent applications related to semi-insulating siliconcarbide (SiC) material and power device technology from German car corporation Daimler AG. The portfolio consists of approximately 20 patent families including issued patents in the US, Germany, Japan, and China. Financial terms were not disclosed. U.S. Patent No. 5,856,231 ('231) titled “Process for Producing High- Resistance Silicon Carbide” is...  — Dawn Hightower

December 2009   [Industry News]
Agilent Acquires Keithley Product Line
Agilent, Keithley, have announced the completion of the sale of substantially all of Keithley’s radio-frequency product line to Agilent, which is based in Santa Rosa, CA. The parties had signed a definitive agreement for the approximately $9-million sale on November 19. With the completion of the sale, the majority of the Keithley RF team of about two dozen employees in Santa Rosa will become Agilent employees. In addition, Agilent will provide...  — Dawn Hightower

November 2009   [Industry News]
Alliance Transfers NXP’s T&D Team to Virage
NXP Semiconductors and Virage Logic Corp. have announced a strategic agreement that accelerates NXP’s move to high-performance mixed signal leadership and will broaden Virage Logic’s semiconductor IP portfolio. NXP will transfer a part of its advanced CMOS intellectual property rights and certain engineering talent and equipment to Virage Logic. This arrangement includes a long-term licensing and IP development relationship between the two companies,...  — Dawn Hightower

October 2009   [Industry News]
TIA Maps Out Market Competition Plan
The Telecommunications Industry Association (TIA) has urged the Federal Communications Commission (FCC) to increase the amount of available commercial spectrum. In doing so, it will support research and development that will produce innovative wireless technologies. The TIA also wants the FCC to embrace pro-competitive regulations that will drive wireless market competition, increase investment and innovation, and speed new wireless products to market. ...  — Dawn Hightower

September 2009   [Industry News]
EI Secures Financing For Security Chip
Congressman Maurice Hinchey (D-NY) has secured a $6-million federal investment for Endicott Interconnect Technologies (EI) to develop microelectronic chips that safeguard against the foreign tampering of weapons. With this chip, the military will be able to ensure that no foreign government or hostile organization has tampered with US weapons. The microchips are expected to be used for unmanned ground and aerial vehicles, artillery shells, robots, satellites,...  — Dawn Hightower

August 2009   [Industry News]
Interplex Acquires Quantum Leap Packaging
INTERPLEX INDUSTRIES has acquired Quantum Leap Packaging, Inc. (QLP). This transaction involves all of QLP’s proprietary technologies including resin technologies like Quantech. Interplex will integrate QLP’s packaging technology into its Interplex Engineered Products (IEP) facility in East Providence, RI and eventually expand it to the global market. To maintain the original vision of the founder as a “Quantum Leap” in technology, QLP’s new name will...  — Dawn Hightower

July 2009   [Industry News]
CSR And SiRF Complete Merger
CSR plC and SiRF TeChnology holdingS, inC. (SiRF) have completed the merger between SiRF and a wholly owned subsidiary of CSR. Customers of the enlarged CSR group will be able to deliver new user experiences of connectivity and location technologies in a diverse range of devices, such as mobile phones, personal navigation devices, in-car navigation and telematics systems, laptop and netbook PCs, mobile Internet devices, digital cameras, gaming machines,...  — Dawn Hightower

June 2009   [Industry News]
WiSpry Closes Additional Series C Financing
WISPRY, INC. HAS CLOSED an additional $10 million of Series C financing, which brings the total of the Series C round to $20 million. The round was led by two new investment partners, Chart Venture Partners and Acadia Woods Partners. This funding round will help to expand the company’s operations, engineering, and applications-support structure as WiSpry begins production shipments to leading wireless-handset OEMs and ODMs this summer. WiSpry,...  — Dawn Hightower

May 2009   [Industry News]
Harris Buys Tyco’s Wireless Systems Business
HARRIS CORP. HAS signed a definitive agreement to acquire Tyco Electronics’ (formerly known as M/A-COM) Wireless Systems business for $675 million in cash subject to post-closing adjustments. The goodwill arising on completion of this acquisition will be an allowable tax expense with an estimated net present value of $60 million, resulting in an effective purchase price of $615 million. Tyco Electronics Wireless Systems, a business segment of Tyco...  — Dawn Hightower

April 2009   [Industry News]
FreeWave Founders Share Financial Success
FREEWAVE TECHNOLOGIES HAS distributed the third installment of a $9-million equity bonus to its employees. The bonus is part of a $113-million private-equity transaction. It was given by the company founders, CEO Steve Wulchin and CTO Jonathan Sawyer, to reward employees for the hard work and dedication that has helped Free- Wave become a leading supplier of high-performance spread-spectrum and licensed radio products and services. According to...  — Dawn Hightower

March 2009   [Industry News]
Joint Venture ST-Ericsson Is Born
ST-ERICSSON HAS BEEN born out of the 50/50 joint venture that united the wireless semiconductor division of STMicroelectronics and the mobile platform division of Ericsson. This announcement follows the closing of the agreement announced from both parent companies in August 2008 to merge Ericsson Mobile Platforms and ST-NXP Wireless. ST-Ericsson, which will be headquartered in Geneva, Switzerland, is expected to be a driving force in the wireless...  — Dawn Hightower

February 2009   [Industry News]
SkyCross Secures $23 Million In Investment
Antenna-maker SkyCross has secured $23 million in financing led by Investor Growth Capital. This investment caps a successful year for the firm, which reported 65-percent year-over-year revenue growth. The companyâ??s performance in 2008 is the latest in a four-year span that has produced over 50-percent growth annually. With this latest investment, SkyCross plans to broaden its geographic reach, gain additional worldwide Tier 1...  — Dawn Hightower

January 2009   [Industry News]
Sigma Designs Acquires Zensys Holdings
SIGMA DESIGNS, a fabless provider of highly integrated system-on-a-chip (SoC) solutions, has signed a definitive agreement to acquire Zensys Holdings Corp., a wireless startup company headquartered in Fremont, CA. Upon completion of the acquisition, Zensys’ headquarters will be physically merged into the headquarters of Sigma Designs in the neighboring city of Milpitas. Zensys also has a research and development center located in Copenhagen, Denmark,...  — Dawn Hightower





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