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Materials 21 results found for Materials, displaying items 1 - 20

--> March
Microwave Materials Help Build An Industry
Materials suppliers are constantly refining their recipes in search of products that offer greater value and increased reliability for a variety of commercial, industrial, and military applications Jack Browne Technical Director Microwave materials represent building blocks for high-frequency circuits and systems. Whether they are used to hold circuit traces, absorb or suppress radiofrequency interference (RFI), or form resonant...  — Jack Browne

March
Metamaterials Show Potential For Planar Components
Metamaterials intrigue researchers for their potential to fabricate tunable and wideband passive components. Because of line parasitics, the reactive elements responsible for the left-handed (LH) band exhibit a forward or right-handed (RH) transmission band at higher frequencies. Usually, they are separated from the LH band by a stop band. Due to the composite behavior of LC loaded lines, these structures were called composite right/left-handed (CRLH) transmission lines....  — Nancy Friedrich

February 21, 2008
Fine Tuning Those Microwave Materials
 — Jack Browne

February
Gore Celebrates 50 Years Of PTFE
Most RF/microwave engineers know it by the acronym PTFE rather than the full name of polytetrafluoroethylene. The polymer is ever-present in the high-frequency industry in coaxial and fiber-optic cables, printed-circuitboard (PCB) materials, and electromagnetic-interference (EMI) shielding materials and gaskets. It is also the basis for innovative products in other industries, ranging from energy to medicine. The company behind the many applications for PTFE is W. L....  — Jack Browne

August 2007
Predict Resonances Of Shielded PCBs
Shielded enclosures are commonly used as protection for microwave printed-circuit boards (PCBs). While the enclosure can guard a PCB from environmental effects, it can also alter the electrical performance of the circuit. Understanding the effects of the enclosure and how to predict them can improve the accuracy of most modern computeraided-engineering (CAE) simulation tools. As Part 1 of this two-part article series explored last month, the effects of the shielded...  — Avinash Sharma

August 2007
BeO Takes The Heat In RF Transistor Packages
Power-transistor packaging is not immune to the cost pressures facing commercial RF and microwave markets. RF power-transistor suppliers have long sought alternative materials to traditional insulating materials such as ceramics, including BeO. But the superior characteristics of BeO continue to make it the material of choice at the highest power levels at frequencies up to 4 GHz, especially in demanding military and aerospace pulsed power applications. BeO...  — John E. Scheatzle

August 10, 2007
August 9, 2007 Newsletter
 — Jack Browne

August 9, 2007
PCB Industry To Flourish
 — Jack Browne

April 26, 2007
Remtec Develops Etchable Materials Capability
 — Jack Browne

April 2007
Developing Designs For RFID Transponder Using DTMOS
Transponder design for radio-frequency-identification (RFID) circuits must overcome many of the challenges faced by other low-power electronic applications. RFID transponder circuitry must be low in cost, and must operate over long periods of time on limited power sources. Earlier in the article series (Microwaves & RF, September 2006, p. 57 and October 2006, p. 82), basic design strategies were presented for designing RFID transponder integrated circuits (ICs) and...  — A. Kordesch , et al.

March 2007
PCTF Approach Saves MW/RF Component/Module Costs
Packaging is a critical part of RF/microwave component and module design. The package provides protection but, at higher frequencies, is also part of the circuitry. For that reason, the package must provide excellent electrical performance, environmental protection, shielding, and a host of other characteristics in support of a module or component. Ceramic materials are often the primary choice for these critical packaging applications. Ceramics feature stable...  — Nahum Rapoport

December 2004
Novel Contacts Aid Lead-Free Packaging
Electronics manufacturing is steadily moving toward the use of lead-free packaging and lead-free printed-circuit-board (PCB) attachments. The European Union (EU) has already established Directive 2002/95/EC on the restriction of certain hazardous...  — Jack Browne

August 2004
Liquid-Crystalline Polymers Bond Multilayer Circuits
Flexible circuits have long been associated with polyimide films, although such materials have been limited in high-frequency performance. The R/flex® 3000 line of liquid-crystal-polymer (LCP) circuit materials from Rogers Corp....  — Jack Browne

April 7, 2004
Infineon Cools Down LDMOS Transistors
 — Jack Browne

November 2003
Novel Materials Form Tunable Components
Tuning a high-frequency circuit usually involves trimming a variable capacitor or turning a mechanical tuner. By using innovative circuit materials formed of barium-strontium-titanate (BST) dielectric, however, Agile Materials & Technologies...  — Jack Browne

October 24, 2003
Miniature Microwave Furnace Aids Materials Research
 — Jack Browne

October 24, 2003
HTS Technology Advanced For Government/Military Applications
 — Jack Browne

October 2003
Engineered Substrates Yield High Stability
Temperature stability is a key to the successful integration of numerous components, including filters and resonators, in wireless and other designs. For example, surface-acoustic-wave (SAW) devices offer superb selectivity, although with performance...  — Jack Browne

August 2003
Mounting Technique Aids MMIC Performance
Performance levels of high-frequency monolithic-microwave integrated circuits (MMICs) are often compromised within packages and circuits. Fortunately, a novel technique for mounting MMICs in microstrip circuits helps optimize device performance even...  — Larry Silverman

May 2003
Improve PCB Shielding For Portable Devices
Miniaturization of handsets and other wireless devices creates scores of shielding challenges as high-frequency components become more closely spaced. As printed-circuit boards (PCBs) shrink, new electromagnetic-interference (EMI) shielding...  — Thomas Clupper





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